High resolution linear scale for accurate positioning,
• Newly developed positioning system improves positioning speed by 50% and overall cycle time by 15%.
• Innovative Optical systems consist of an optical head, side-angle cameras.
• Phase Measurement Profilometry technology provides the 3rd dimension of the Z axis with height range 1-20mm & 1m height resolution.
• CoaXPress camera for faster inspection & measurement process
• Scalable optical resolutions of 7μm, 12μm and 18μm
• Flexible gantry for M/L/XL PCBA sizes and dual lanes.
• One common platform supports 3D-SPI, 3D-AOI, and 3D-AXI.
• Extra component detection (ECD) functions.
• Through-hole device solder inspection Verification (Fujiyama algorithm)
• Feed-back from AOI to Pick-and-Place.
• Supports Total Smart Factory Inspection Solution – BF2-Editor/BF2-Monitor (RMS/MPV)