Description
Specifications
Parameter | Value |
---|---|
Camera Resolution | 18μm |
Board Size | 50×50 – 460×500mm |
Board Thickness | 0.6 – 2.5mm, 24 – 100 mils |
Board Wrap | +/-2mm, 79 mils |
PCB Clearance | Top: 40mm Bottom: 60mm |
Rotated Component Support | Available for 0 – 359°rotation (unit of 1°) |
Inspection Categories | Presence/Absence, Misalignment, Tombstone, Reverse, Polarity, Bridge,
Foreign material, Absence of solder, Insufficient solder, Lifted lead, Lifted Chip, and Fillet defect. Each defect name can be changed freely by system function. |
Image Scanning / Tact Time | Approx. 10 Sec / 18 Sec |
Camera | Line colour CCD camera |
Lighting | LED lighting system |
Optional System | BF-Editor / BF-RP1 / BF-View |
Optional | 2D Barcode Recognition, Journal Printer, OK/NG Signal Out |
Power Consumption | 700VA |
Dimensions (W x D x H) | 800 × 1280 × 600mm |
Weight | Approx. 175 kg |
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