Manufacturer :

• Automated high-resolution 3D, X-Ray measurement technology
• Visualize the inner structure of PCBA to eliminate defects.
• Broaden the range of objects able to be inspected, from Semiconductor to Power module.
• High-resolution and highly stable open X-ray tube.
• Prolonged stability with the high-rigidity gantry structure.
• High safety, based on European standards.
• Identifying various defects using high-resolution CT data.
• Seamless 3D data improves inspection efficiency
• Utilize automated 3D image reconstruction to perform inspection and analysis at the same time.
• The BF-X2 can inspect electronic components, solder, voids in microscopic pores, Head-in-Pillow (HiP), non-whetting, and multi-layer solder inspection for power modules.
• Planar CT (PCT)has high resolution in both the horizontal and vertical directions. PCT produces high-resolution images for even the bottom side of the PCBA.
• The BF-Monitor Repair Terminal allows operators to verify defects in 3D images.
• BF2-Editor offline programming software allows the user to automatically create inspection parameter data, directly from the CAD data.




Model Name BF-X2
X-ray Tube 130 kV / 200 kV Open X-ray Tube
Resolution 130kV model : 8 to 25μm 200kV model :21 to 68μm
PCB Size 130kV model : 50 x 120 to 460 x 510mm
200kV model : 50 x 140 to 460 x 510mm
PCB Thickness 0.8 to 4.0mm
PCB Warp +/- 2mm
Component Height Top: 40mm, Bottom: 40mm
Inspection Categories Surface Mount Device
Presence/Absence, Misalignment, Tombstone, Bridge, Foreign material, Absence of solder, Insufficient solder, Dry-joint, Lifted lead, Lifted bump, Lifted chip, Fillet defect, Void, HIP
IGBT Devices
Void Inspection of a Solder
Packaged Print Circuit Board
Void Inspection of a Through Hole
Flip Chip Device (Inner bump)
Dry Joint, Void
3DCapturingSpeed(PlanarCT) Approx. 6 sec./FOV
Detector 130kV model : 14 bit, 3M Pixel | 200kV model : 12 bit, 1M Pixel
X-ray Leakage 0.5μSV/h or less
Operating System Windows 7 English Version



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