Description
Specifications
Model Name | BF-X3 | |
Resolution | 13 to 30μm | |
PCB Size | 50 x 120 to 460 x 510mm | |
PCB Thickness | 0.8 to 4.0mm | |
PCB Warp | +/- 2mm | |
Component Height | Top: 40mm, Bottom: 40mm | |
Inspection Categories | Surface Mount Device Non-wetting, Head-in-Pillow (HiP), fillet defect, lifted Lead, lifted component, excessive/insufficient solder, missing component, flipped component, tombstone, misplaced component, bridge, void, pad shape, foreign material, coplanarity. IGBT Devices Solder Void |
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3DCapturingSpeed(PlanarCT) | Approx. 6 sec./FOV | |
Detector | 130kV model : 14 bit, 3M Pixel | 200kV model : 12 bit, 1M Pixel | |
X-ray Leakage | 0.5μSV/h or less | |
Operating System | Windows 7 English Version |
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