BF-X3

BF-X3
Features
• With Saki’s BF-3X Planar CT (PCT) technology, Saki implements a new high-resolution detector and a new CT calculation method for PCBA inspection. These improvements provide much faster throughput.
• Unique “Planar CT” technology generates high-precision inspection data.
• 3D X-ray becomes a major solution in SMT inspection, as
o Dramatically improve cycle time.
o Broaden the range of objects able to be inspected in the PCBA industry.
• Automated high-resolution 3D measurement technology
o Measuring various defects by using high-resolution CT data
o Seamless 3D data improves inspection efficiency
o Utilize automated 3D image reconstruction to perform inspection and analysis at the same time
o Achieve even greater efficiency with Saki’s peripheral systems
• Reliable hardware design
o High-resolution closed X-ray tube
o Prolonged stability with the high-rigidity gantry structure
o High safety based on European standards
Specifications
Model Name | BF-X3 | |
Resolution | 13 to 30μm | |
PCB Size | 50 x 120 to 460 x 510mm | |
PCB Thickness | 0.8 to 4.0mm | |
PCB Warp | +/- 2mm | |
Component Height | Top: 40mm, Bottom: 40mm | |
Inspection Categories | Surface Mount Device Non-wetting, Head-in-Pillow (HiP), fillet defect, lifted Lead, lifted component, excessive/insufficient solder, missing component, flipped component, tombstone, misplaced component, bridge, void, pad shape, foreign material, coplanarity. IGBT Devices Solder Void | |
3DCapturingSpeed(PlanarCT) | Approx. 6 sec./FOV | |
Detector | 130kV model : 14 bit, 3M Pixel | 200kV model : 12 bit, 1M Pixel | |
X-ray Leakage | 0.5μSV/h or less | |
Operating System | Windows 7 English Version |