3D SPI
3D SPI
Features
• Saki’s 3D SPI system ensures high repeatability of inspection results
• Height Inspection repeatability of 2μm at 3σ and volume inspection repeatability of +/- 3% with a high gauge repeatability and reproducibility (GR&R).
• Inspects for Height, Volume, Area, Bridging, Offset & Shape.
• Phase Measurement Profilometry with LCoS technology used for optimum results.
• Rigid gantry structure, dual motor-drive system & High resolution linear scale for accurate positioning
• CoaXPress camera for faster & Simultaneous 2D and 3D inspection of the entire board
• Scalable optical resolutions of 7μm, 12μm and 18μm
• Flexible gantry for M/L/XL PCBA sizes and dual lanes
• One common platform supports 3D-SPI, 3D-AOI, and 3D-AXI
• Saki Self-Programming (SSP) Software increases measurement and inspection speed by about 190%
• Coplanarity inspection ⁃ SPC function available.
• History Management System for data logging and history
Specifications
| Optical unit Resolution | 7µ | 12µ | 18µ |
| Height measurement range | 4 mm | 10 mm | 20 mm |
| Image Capture Time | 1063 mm 2/Sec | 5500 mm 2/Sec | 6400 mm 2/Sec |
| Inspection Categories | Height, Volume, Area, Bridging, Offset & Shape | ||
| Electric Power | Single Phase 〜 200-240 V+/-10%, 50/60 Hz | ||
| PCB Size (mm) | Single Lane Dual Lane 50×60〜330×330 50×60〜320×330 | ||
| PCB Clearance | Top: 40 mm & Bottom:50-60 mm | ||
| Size(W×D×H) (mm) | 850 × 1430 × 1500 | ||
| Weight | 850 kg | ||