3D AOI
3D AOI
Features
High resolution linear scale for accurate positioning,
• Newly developed positioning system improves positioning speed by 50% and overall cycle time by 15%.
• Innovative Optical systems consist of an optical head, side-angle cameras.
• Phase Measurement Profilometry technology provides the 3rd dimension of the Z axis with height range 1-20mm & 1m height resolution.
• CoaXPress camera for faster inspection & measurement process
• Scalable optical resolutions of 7μm, 12μm and 18μm
• Flexible gantry for M/L/XL PCBA sizes and dual lanes.
• One common platform supports 3D-SPI, 3D-AOI, and 3D-AXI.
• Extra component detection (ECD) functions.
• Through-hole device solder inspection Verification (Fujiyama algorithm)
• Feed-back from AOI to Pick-and-Place.
• Supports Total Smart Factory Inspection Solution – BF2-Editor/BF2-Monitor (RMS/MPV)
Specifications
| Optical unit Resolution | 7µ | 12µ | 18µ |
| Height measurement range | 4 mm | 10 mm | 20 mm |
| Image Capture Time | 1063 mm 2/Sec | 3600 mm 2/Sec | 5700 mm 2/Sec |
| Inspection Categories | Bent Lead, Bill boarding, Bridging, Coplanarity, Copper Exposure, Damaged Components, Defective/Damaged Components, Dry Joints/Absence of Solder, Excess Solder, Fillet Defect, Foreign Material, Gold Finger, Height Defects, Inclined Components, Incorrect Component, Insufficient Solder, Inverted J-leads, Lifted Chip, Lifted Lead, Misalignment, Missing | ||
| Electric Power | Single Phase 〜 200-240 V+/-10%, 50/60 Hz | ||
| PCB Size (mm) | Single Lane Dual Lane 50×60〜330×330 50×60〜320×330 | ||
| PCB Clearance | Top: 40 mm & Bottom:60 mm | ||
| Size(W×D×H) (mm) | 850 × 1430 × 1500 | ||
| Weight | 850 kg | ||