Manufacturer :

• Saki’s 3D SPI system ensures high repeatability of inspection results
• Height Inspection repeatability of 2μm at 3σ and volume inspection repeatability of +/- 3% with a high gauge repeatability and reproducibility (GR&R).
• Inspects for Height, Volume, Area, Bridging, Offset & Shape.
• Phase Measurement Profilometry with LCoS technology used for optimum results.
• Rigid gantry structure, dual motor-drive system & High resolution linear scale for accurate positioning
• CoaXPress camera for faster & Simultaneous 2D and 3D inspection of the entire board
• Scalable optical resolutions of 7μm, 12μm and 18μm
• Flexible gantry for M/L/XL PCBA sizes and dual lanes
• One common platform supports 3D-SPI, 3D-AOI, and 3D-AXI
• Saki Self-Programming (SSP) Software increases measurement and inspection speed by about 190%
• Coplanarity inspection ⁃ SPC function available.
• History Management System for data logging and history



Optical unit Resolution 12µ 18µ
Height measurement range 4 mm 10 mm 20 mm
Image Capture Time 1063 mm 2/Sec 5500 mm 2/Sec 6400 mm 2/Sec
Inspection Categories Height, Volume, Area, Bridging, Offset & Shape
Electric Power Single Phase 〜 200-240 V+/-10%, 50/60 Hz
PCB Size (mm) Single Lane                          Dual Lane
50×60〜330×330             50×60〜320×330
PCB Clearance Top: 40 mm & Bottom:50-60 mm
Size(W×D×H) (mm) 850 × 1430 × 1500
Weight 850 kg


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