Description
Specifications
| Camera Resolution | 10μm | |
| Board Size | 50×50 – 250×330mm | |
| Board Thickness | 0.6 – 2.5mm | |
| Board Warp | +/-2mm, 79mils | |
| PCB Clearance | Top: 40mm Bottom: 40mm | |
| Rotated Component Support | Available for 0 – 359°rotation (unit of 1°) | |
| Inspection Categories | Presence/Absence, Misalignment, Tombstone, Reverse, Polarity,
Bridge, Foreign material, Absence of solder, Insufficient solder, Lifted lead, Lifted Chip, and Fillet defect. Each defect name can be changed freely by system function. |
|
| Image Scanning | Approx. 9 Sec / 18 Sec. | |
| Camera | Line colour CCD camera | |
| Lighting | LED lighting system | |
| Optional System | BF-Editor / BF-RP1 / BF-View | |
| Optional | 2D Barcode Recognition, Journal Printer, OK/NG Signal Out | |
| Power Consumption | 450VA | |
| Dimensions (W x D x H) | 700 x 1215 x 1104mm | |
| Weight | Approx. 430 kg, | |
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