Manufacturer :

• Cost-Effective 2D Bottom-side Automated Optical Inspection (AOI) System.
• Ensures PCB quality after DIP, Selective soldering & Wave soldering.
• Completely automates bottom side Inspection (pin, through Hole Fillets).
• Eliminates the need for flipping the PCBs.
• Increases the productivity by reducing time, cost and the floor space for additional equipment to Flip the PCB.
• Automates the Bottom side Inspection Just with one equipment.
• Supports L-Size PCBs, High clearance, heavy substrates and mounted Jigs.
• Fujiyama Algorithm provides complete Through hole joint inspection in a single step.



Camera Resolution 18μm
Machine Type Inline / Single Lane
Board Size Carrier : 610 x 610 mm
Scan: 460 x 500 mm
Board Thickness 0.6 – 2.5mm
PCB Weight 12 Kg
PCB Clearance Top: 120mm
Bottom: 40mm
Rotated Component Support Available for 0 – 359°rotation (unit of 1°)



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