• Cost-Effective 2D Bottom-side Automated Optical Inspection (AOI) System.
• Ensures PCB quality after DIP, Selective soldering & Wave soldering.
• Completely automates bottom side Inspection (pin, through Hole Fillets).
• Eliminates the need for flipping the PCBs.
• Increases the productivity by reducing time, cost and the floor space for additional equipment to Flip the PCB.
• Automates the Bottom side Inspection Just with one equipment.
• Supports L-Size PCBs, High clearance, heavy substrates and mounted Jigs.
• Fujiyama Algorithm provides complete Through hole joint inspection in a single step.